IC inspection
With pattern matching of the shape and filtered color contrast the inspection can still be cost-effective and fast.
Challenge
When an IC package and lead frame are inspected, color variations and the shape of the surface make it difficult to detect failures. It also takes time for setting up when the changeover takes place. And a conventional vision sensor is not fast enough for the continuous inspection.
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Solution
With pattern matching of the shape and filtered color contrast, defective products can be distinguished with certainty. Real-time search allows inspection in fast production lines.
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Benefit
A cost-effective and high-speed solution for strict quality control with improved through-put and easy setting-up that saves further time.
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