As device structures become more complex, highly accurate measurement of the wafers & chips that make up the device is required. Accurate measurement of wafers & chips is critical to ensure high quality semiconductor production.
Application: Height measurement of wafers & chips
Wafer warp Measurement can be challenging. These issues can be caused by a variety of factors, such as tension stress during processing or temperature variations. As wafers become thinner, warpage during wafer processing tends to become more pronounced. The inability to accurately measure the object can negatively impact the performance and yield of semiconductor devices.
Our Solution: Non-contact, high-precision displacement sensing technology
OMRON’s confocal laser measurement technologies are suited for wafer warp challenges. They offer non-contact methods to measure the wafer while achieving high repeatability.
OMRON's, unique, white light confocal displacement sensor provides higher resolution measurements of angled or curved and shiny surfaces than traditional laser displacement sensors.
Application: Z axis adjustment of chip bonding
Measuring the height of chips can be challenging. With the advent of devices such as 3D-ICs, chips of various heights and materials must each be measured accurately. The inability to accurately measure the object also has a significant impact on Z-axis height adjustment during bonding head operations.
Our Solution: Non-contact, high-precision displacement sensing technology
OMRON’s confocal laser measurement technologies are suited for Z-axis height adjustment challenges. They provide non-contact methods to measure the chips while achieving high repeatability.
OMRON’s unique, white light confocal displacement sensor provides higher resolution measurements of angled or curved and shiny surfaces than traditional laser displacement sensors.
Enabling Technologies
White light confocal principle
OMRON is among the first in the industry to adopt the white light confocal principle when it introduced the ZW Series. This principle allows a stable moving measurement of objects in any mixed conditions such as coarse, curved, inclined or narrow areas.
Related Products
Non-contact, Confocal, white LED displacement sensor
Strict quality control, production speed and appearance inspection are constantly increasing. To meet these demands, stable measurements during movement for quality inspection without compromising manufacturing speed are required. Harnessing the benefits of the white light confocal principle, the ZW Series meets these demands for most any material type (glass, metal, plastic, etc.) and shape (round, flat, uneven, etc).
Do you want to know more?
Contact Our Experts
Ota minuun yhteyttä Precise Height Measurement
Kiitos yhteydenotostasi. Otamme teihin yhteyttä mahdollisimman pian.
Meillä on teknisiä ongelmia. Emme ole pystyneet vastaanottamaan lomakettasi. Pahoittelemme ja pyydämme yrittämään uudelleen myöhemmin.
Download